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Mayappan, Ramani
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Mayappan, Ramani
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1
Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad
by
Mayappan
,
Ramani
,
Ahmad, Zainal Arifin
Published 2010
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2
The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan
by
Yahya, Iziana
,
Abd Hamid, Hamidi
,
Mayappan
,
Ramani
Published 2012
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Related Subjects
Solder and soldering
Intermetallic compounds
Metallurgy
Powder metallurgy
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