Estimation of pseudo-diffusion coefficient D* using different settings of low b-values in liver IVIM imaging

by Meng-Chieh Liao, 廖孟潔
Published 2016

Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges

by Meng-Chieh Liao, Pu-Shan Huang, Yi-Hsien Lin, Ming-Yi Tsai, Chen-Yu Huang, Te-Chin Huang
Published 2017-07-01