Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint

by Aimi Noorliyana Hashim, Mohd Arif Anuar Mohd Salleh, Andrei Victor Sandu, Muhammad Mahyiddin Ramli, Khor Chu Yee, Noor Zaimah Mohd Mokhtar, Jitrin Chaiprapa
Published 2021-02-01

Effect of Electromigration and Thermal Ageing on the Tin Whiskers’ Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints

by Noor Zaimah Mohd Mokhtar, Mohd Arif Anuar Mohd Salleh, Andrei Victor Sandu, Muhammad Mahyiddin Ramli, Jitrin Chaiprapa, Petrica Vizureanu, Mohd Izrul Izwan Ramli
Published 2021-08-01