Controlled crack propagation for atomic precision handling of wafer-scale two-dimensional materials

by Nezich, Daniel, Park, Yong Ju, Sundaram, Suresh, Li, Xin, Yue, Ruoyu, Zhou, Guanyu, Ahn, Jong-Hyun, Ougazzaden, Abdallah, Shim, Jaewoo, Bae, Sanghoon, Kong, Wei, Lee, DoYoon, Qiao, Kuan, Zhao, Ruike, Yeon, Hanwool, Choi, Chanyeol, Kum, Hyunseong, Ou, Yunbo, Lee, Kyusang, Moodera, Jagadeesh, Zhao, Xuanhe, Hinkle, Christopher W., Kim, Jeehwan
Published 2019