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Sri Harini Rajendran
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Sri Harini Rajendran
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Sri Harini Rajendran
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1
Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics
by
Hyejun Kang
,
Sri
Harini
Rajendran
,
Jae Pil Jung
Published 2021-02-01
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Article
2
Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO<sub>2</sub> Nanoparticles
by
Sri
Harini
Rajendran
,
Seung Jun Hwang
,
Jae Pil Jung
Published 2020-09-01
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Article
3
Effect of ZrO2 Nanomaterials on Wettability and Interfacial Characteristics of Al-19Cu-11Si-2Sn Filler Metal for Low Temperature Al to Cu Dissimilar Brazing
by
Do-Hyun Jung
,
Sri
Harini
Rajendran
,
Jae-Pil Jung
Published 2018-10-01
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Article
4
Active Brazing of Alumina and Copper with Multicomponent Ag-Cu-Sn-Zr-Ti Filler
by
Sri
Harini
Rajendran
,
Seung Jun Hwang
,
Jae Pil Jung
Published 2021-03-01
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Article
5
Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics
by
Sri
Harini
Rajendran
,
Jung Do Hyun
,
Jeon Wook Sang
,
Jung Jae Pil
Published 2019-02-01
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Article
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