A Study on the Effect of Bond Wires Lift-off on IGBT Thermal Resistance Measurement

by Dan Luo, Minyou Chen, Wei Lai, Hongjian Xia, Xueni Ding, Zhenyu Deng
Published 2021-01-01

Condition Monitoring in a Power Module Using On-State Resistance and Case Temperature

by Wei Lai, Yuanpei Zhao, Minyou Chen, Yueyue Wang, Xueni Ding, Shengyou Xu, Liangming Pan
Published 2018-01-01