Noise coupling between through-silicon vias and active devices for 20/14-nm technology nodes

by Runiu FANG, Xin SUN, Min MIAO, Yufeng JIN
Published 2015-04-01

Fabrication of All-GaN Integrated MIS-HEMTs with High Threshold Voltage Stability Using Supercritical Technology

by Meihua Liu, Yang Yang, Changkuan Chang, Lei Li, Yufeng Jin
Published 2021-05-01

3D Semantic VSLAM of Indoor Environment Based on Mask Scoring RCNN

by Chongben Tao, Yufeng Jin, Feng Cao, Zufeng Zhang, Chunguang Li, Hanwen Gao
Published 2020-01-01

A Novel Ultrasonic TOF Ranging System Using AlN Based PMUTs

by Yihsiang Chiu, Chen Wang, Dan Gong, Nan Li, Shenglin Ma, Yufeng Jin
Published 2021-03-01

A RF Redundant TSV Interconnection for High Resistance Si Interposer

by Mengcheng Wang, Shenglin Ma, Yufeng Jin, Wei Wang, Jing Chen, Liulin Hu, Shuwei He
Published 2021-02-01

Design, Fabrication, and Performance Characterization of LTCC-Based Capacitive Accelerometers

by Huan Liu, Runiu Fang, Min Miao, Yichuan Zhang, Yingzhan Yan, Xiaoping Tang, Huixiang Lu, Yufeng Jin
Published 2018-03-01