Improvement of Sintering Performance of Nanosilver Paste by Tin Doping
Nanosilver paste, an interconnect solder, is a common choice in the electronics packaging industry. However, higher sintering temperature and lower sintering strength limit its application. At present, doped nanosilver paste has been studied for use in chip interconnection. In order to improve the s...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Hindawi Limited
2020-01-01
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| Series: | Journal of Nanomaterials |
| Online Access: | http://dx.doi.org/10.1155/2020/3925276 |