Parallel glide: flow of dislocations with internal stress source/sink distribution
The unexpected glide of dislocations on a plane parallel to the film/substrate interface in ultrathin copper films, which has been called parallel glide (Balk et al 2003 Acta Metall. 51 447), is described using an analytical model. The phenomenon is observed as a problem involving inlet/outlet flow...
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| Format: | Article |
| Language: | English |
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Taylor & Francis Group
2008-01-01
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| Series: | Science and Technology of Advanced Materials |
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| Online Access: | http://www.iop.org/EJ/abstract/1468-6996/9/1/015008 |