Two-dimensional simulations of multi-hollow VHF SiH4/H2 plasma

A triode multi-hollow VHF SiH4/H2 plasma (60 MHz) was examined at a pressure of 20 Pa by two-dimensional simulations using the fluid model. In this study, we considered the effect of the rate constant of reaction, SiH3 + SiH3→SiH2 + SiH4, on the plasma characteristics. A typical VHF plasma of a high...

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Main Authors: Li-Wen Su, Weiting Chen, Kiichiro Uchino, Yoshinobu Kawai
Format: Article
Language:English
Published: AIP Publishing LLC 2018-02-01
Series:AIP Advances
Online Access:http://dx.doi.org/10.1063/1.5003911
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spelling doaj-0476d3af0ab248a8b8e41611eee6c2e22020-11-24T23:06:07ZengAIP Publishing LLCAIP Advances2158-32262018-02-0182025316025316-1010.1063/1.5003911064802ADVTwo-dimensional simulations of multi-hollow VHF SiH4/H2 plasmaLi-Wen Su0Weiting Chen1Kiichiro Uchino2Yoshinobu Kawai3Interdisciplinary Graduate School of Engineering Sciences, Kyushu University, Kasuga, Fukuoka 816-85802, JapanInterdisciplinary Graduate School of Engineering Sciences, Kyushu University, Kasuga, Fukuoka 816-85802, JapanInterdisciplinary Graduate School of Engineering Sciences, Kyushu University, Kasuga, Fukuoka 816-85802, JapanInterdisciplinary Graduate School of Engineering Sciences, Kyushu University, Kasuga, Fukuoka 816-85802, JapanA triode multi-hollow VHF SiH4/H2 plasma (60 MHz) was examined at a pressure of 20 Pa by two-dimensional simulations using the fluid model. In this study, we considered the effect of the rate constant of reaction, SiH3 + SiH3→SiH2 + SiH4, on the plasma characteristics. A typical VHF plasma of a high-electron density with a low-electron temperature was obtained between two discharge electrodes. Spatial profiles of SiH3+, SiH2+, SiH3- and SiH3 densities were similar to that of the electron density while the electron temperature had a maximum value near the two discharge electrodes. It was found that the SiH3 radical density did not decrease rapidly near the substrate and the electron temperature was lower than 1 eV, suggesting that the triode multi-hollow plasma source can provide high quality amorphous silicon with a high deposition rate.http://dx.doi.org/10.1063/1.5003911
collection DOAJ
language English
format Article
sources DOAJ
author Li-Wen Su
Weiting Chen
Kiichiro Uchino
Yoshinobu Kawai
spellingShingle Li-Wen Su
Weiting Chen
Kiichiro Uchino
Yoshinobu Kawai
Two-dimensional simulations of multi-hollow VHF SiH4/H2 plasma
AIP Advances
author_facet Li-Wen Su
Weiting Chen
Kiichiro Uchino
Yoshinobu Kawai
author_sort Li-Wen Su
title Two-dimensional simulations of multi-hollow VHF SiH4/H2 plasma
title_short Two-dimensional simulations of multi-hollow VHF SiH4/H2 plasma
title_full Two-dimensional simulations of multi-hollow VHF SiH4/H2 plasma
title_fullStr Two-dimensional simulations of multi-hollow VHF SiH4/H2 plasma
title_full_unstemmed Two-dimensional simulations of multi-hollow VHF SiH4/H2 plasma
title_sort two-dimensional simulations of multi-hollow vhf sih4/h2 plasma
publisher AIP Publishing LLC
series AIP Advances
issn 2158-3226
publishDate 2018-02-01
description A triode multi-hollow VHF SiH4/H2 plasma (60 MHz) was examined at a pressure of 20 Pa by two-dimensional simulations using the fluid model. In this study, we considered the effect of the rate constant of reaction, SiH3 + SiH3→SiH2 + SiH4, on the plasma characteristics. A typical VHF plasma of a high-electron density with a low-electron temperature was obtained between two discharge electrodes. Spatial profiles of SiH3+, SiH2+, SiH3- and SiH3 densities were similar to that of the electron density while the electron temperature had a maximum value near the two discharge electrodes. It was found that the SiH3 radical density did not decrease rapidly near the substrate and the electron temperature was lower than 1 eV, suggesting that the triode multi-hollow plasma source can provide high quality amorphous silicon with a high deposition rate.
url http://dx.doi.org/10.1063/1.5003911
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AT yoshinobukawai twodimensionalsimulationsofmultihollowvhfsih4h2plasma
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