Effect of hexagonal boron nitride on the thermal and dielectric properties of polyphenylene ether resin for high-frequency copper clad laminates
As the base material of the printed circuit boards (PCBs), copper clad laminates (CCLs) with high thermal conductivity, low dielectric loss and high peel strength have been greatly desired especially for the upcoming 5G age. In this study, hexagonal boron nitride (hBN) was firstly introduced into th...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2019-11-01
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| Series: | Materials & Design |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127519304666 |