Modular Architecture of a Non-Contact Pinch Actuation Micropump

Modular Architecture of a Non-Contact Pinch Actuation Micropump

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This paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in polymer casting. Actuator-membrane gap separation was studied, with experimental...

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Bibliographic Details
Main Authors: Ruzairi Abdul Rahim, Pei Ling Leow, Uda Hashim, Tijjani Adam, Rashidah Arsat, Pei Song Chee
Format: Article
Language:English
Published: MDPI AG 2012-09-01
Series:Sensors
Subjects:
electromagnetic micropump
diffuser
lab on chip
hot embossing
Online Access:http://www.mdpi.com/1424-8220/12/9/12572

Internet

http://www.mdpi.com/1424-8220/12/9/12572

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