Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics

Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics

The growing interest towards thinner and conformable electronic systems has attracted significant attention towards flexible hybrid electronics (FHE). Thin chip-foil packages fabricated by integrating ultra-thin monocrystalline silicon integrated circuits (ICs) on/in flexible foils have the potentia...

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Bibliographic Details
Main Authors: Nagarajan Palavesam, Waltraud Hell, Andreas Drost, Christof Landesberger, Christoph Kutter, Karlheinz Bock
Format: Article
Language:English
Published: MDPI AG 2020-02-01
Series:Electronics
Subjects:
system-in-foil
flexible interposer
chip embedding
embedding in flex
fatigue reliability
flip-chip
ultra-thin silicon
chip-on-foil
thin metal film
Online Access:https://www.mdpi.com/2079-9292/9/2/238

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https://www.mdpi.com/2079-9292/9/2/238

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