Fracture analysis of anodically bonded silicon substrates during the CMP process
Abstract In this paper, a stress and fracture study, occurring during the chemical mechanical polishing (CMP) of anodically bonded substrates is presented. The samples contain glass pillars, used to form the glass cavities and a silicon substrate sealing the glass structure, the samples are fabricat...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
SpringerOpen
2018-12-01
|
| Series: | Micro and Nano Systems Letters |
| Subjects: | |
| Online Access: | http://link.springer.com/article/10.1186/s40486-018-0075-0 |