Numerical Simulation of Failure of Composite Coatings due to Thermal and Hygroscopic Stresses
Due to the higher thermal and moisture expansions of epoxy coatings than the rigid substrate, these coatings suffer from high thermal and hygroscopic stresses, leading to coating/substrate interfacial crack growth. Herein, a parametric study was conducted systematically on epoxy coatings incorporate...
Main Authors: | , , , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2019-04-01
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Series: | Coatings |
Subjects: | |
Online Access: | https://www.mdpi.com/2079-6412/9/4/243 |