Numerical Simulation of Failure of Composite Coatings due to Thermal and Hygroscopic Stresses

Numerical Simulation of Failure of Composite Coatings due to Thermal and Hygroscopic Stresses

Due to the higher thermal and moisture expansions of epoxy coatings than the rigid substrate, these coatings suffer from high thermal and hygroscopic stresses, leading to coating/substrate interfacial crack growth. Herein, a parametric study was conducted systematically on epoxy coatings incorporate...

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Bibliographic Details
Main Authors: Helezi Zhou, Hong-Yuan Liu, Kunkun Fu, Hong Yuan, Xusheng Du, Yiu-Wing Mai
Format: Article
Language:English
Published: MDPI AG 2019-04-01
Series:Coatings
Subjects:
epoxy composite coating
crack propagation
<i>J</i>-integral
thermal stress
hygroscopic stress
Online Access:https://www.mdpi.com/2079-6412/9/4/243

Internet

https://www.mdpi.com/2079-6412/9/4/243

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