Quasi-3D Thermal Simulation of Integrated Circuit Systems in Packages
The problem of thermal modeling of modern three-dimensional (3D) integrated circuit (IC) systems in packages (SiPs) is discussed. An effective quasi-3D (Q3D) approach of thermal design is proposed taking into account the specific character of 3D IC stacked multilayer constructions. The fully-3D heat...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-06-01
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| Series: | Energies |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1073/13/12/3054 |