Diffusion bonding and brazing of high purity copper for linear collider accelerator structures
Diffusion bonding and brazing of high purity copper were investigated to develop procedures for joining precision machined copper components for the Next Linear Collider (NLC). Diffusion bonds were made over a range of temperatures from 400 °C to 1000 °C, under two different loading conditions [3.45...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
American Physical Society
2001-05-01
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| Series: | Physical Review Special Topics. Accelerators and Beams |
| Online Access: | http://doi.org/10.1103/PhysRevSTAB.4.053502 |