Atomic-Scale Characterization of Slip Deformation and Nanometric Machinability of Single-Crystal 6H-SiC
Abstract As an important third-generation semiconductor material, the micro-deformation and removal mechanism of 6H-SiC at the atomic scale are vital for obtaining ultra-smooth and damage-free surface with atomic steps. Due to the difficulties in directly observing the surface/subsurface of nanomach...
Main Authors: | Binbin Meng, Dandan Yuan, Shaolin Xu |
---|---|
Format: | Article |
Language: | English |
Published: |
SpringerOpen
2019-09-01
|
Series: | Nanoscale Research Letters |
Subjects: | |
Online Access: | http://link.springer.com/article/10.1186/s11671-019-3123-7 |
Similar Items
-
A Nanomechanical Analysis of Deformation Characteristics of 6H-SiC Using an Indenter and Abrasives in Different Fixed Methods
by: Jisheng Pan, et al.
Published: (2019-05-01) -
Effect of impurities on the Raman scattering of 6H-SiC crystals
by: Shenghuang Lin, et al.
Published: (2012-12-01) -
Theoretical Analysis of SAW Propagation in 3C-SiC/c-AlN
by: Cinzia Caliendo
Published: (2016-03-01) -
Addition of Ge to the H-Si-C chemical system during SiC epitaxy
by: Alassaad, Kassem
Published: (2014) -
Recent advances in joining of SiC-based materials (monolithic SiC and SiCf/SiC composites): Joining processes, joint strength, and interfacial behavior
by: Guiwu Liu, et al.
Published: (2019-03-01)