Particle Technology in Chemical Mechanical Planarization

Particle Technology in Chemical Mechanical Planarization

In order to keep pace with Moore’s law, multilevel metallization has become the process of choice. Having a planar wafer surface before every successive step in multilevel metallization is important. The Chemical Mechanical Planarization (CMP)...

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Bibliographic Details
Main Authors: Kalyan S. Gokhale, Brij M. Moudgil
Format: Article
Language:English
Published: Hosokawa Powder Technology Foundation 2014-03-01
Series:KONA Powder and Particle Journal
Subjects:
cmp
multilevel metallization
abrasive particles
modelling
Online Access:https://www.jstage.jst.go.jp/article/kona/25/0/25_2007010/_pdf/-char/en

Internet

https://www.jstage.jst.go.jp/article/kona/25/0/25_2007010/_pdf/-char/en

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