Study of silicon chip soldering in high-power transistor housing
The aim of this work is to study the possibility of reducing the labor consumption and cost of high-power silicon transistor manufacturing without compromise in transistor low thermal resistance. To this end we experimentally explored replacing Au-Si solder with lead-silver solder or other solders f...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Pensoft Publishers
2017-09-01
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| Series: | Modern Electronic Materials |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2452177917300750 |