Development of Pb-Free Nanocomposite Solder Alloys
As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC) based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs) during aging/reflow. Accordingly, this study exam...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2018-04-01
|
| Series: | Journal of Composites Science |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2504-477X/2/2/28 |