Development of Pb-Free Nanocomposite Solder Alloys

Development of Pb-Free Nanocomposite Solder Alloys

As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC) based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs) during aging/reflow. Accordingly, this study exam...

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Bibliographic Details
Main Authors: Animesh K. Basak, Alokesh Pramanik, Hamidreza Riazi, Mahyar Silakhori, Angus K. O. Netting
Format: Article
Language:English
Published: MDPI AG 2018-04-01
Series:Journal of Composites Science
Subjects:
Pb free
solder alloy
nanocomposite
microstructure
Online Access:http://www.mdpi.com/2504-477X/2/2/28

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