The influence of heat treatment on properties of lead-free solders
The article is focused on the analysis of degradation of properties of two eutectic lead-free solders SnCu0.7 and SnAg3.5Cu0.7. The microstructures of the intermetallic compound (IMC) layers at the copper substrate - solder interface were examined before and after heat treatment at 150°C for 50, 200...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Univerzity of Zilina. Faculty of Mechanical Engineering
2015-02-01
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| Series: | Materiálové Inžinierstvo |
| Subjects: | |
| Online Access: | http://ojs.mateng.sk/index.php/Mateng/article/view/118 |