An analytical model of thermal performance for an eccentric heat source on a rectangular plate with double-sided convective cooling
Heat sources on rectangular plates with double-sided convective cooling are a common application of heat transfer in electronic packaging. However, it is considerably difficult to obtain analytical solutions for improving thermal performance because of the mixed boundary conditions on a plate’s uppe...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2019-02-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/1.5080771 |