Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG)
This paper details an investigation into the microstructure, thermal behaviors and joint strength of Sn-0.7Cu-1.5Bi solder alloy on electroless nickel immersion gold (ENIG) surface finish. Besides conventional techniques, the real-time synchrotron imaging was used to analyze the microstructure evolu...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785421002957 |