Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG)
This paper details an investigation into the microstructure, thermal behaviors and joint strength of Sn-0.7Cu-1.5Bi solder alloy on electroless nickel immersion gold (ENIG) surface finish. Besides conventional techniques, the real-time synchrotron imaging was used to analyze the microstructure evolu...
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doaj-114f8fa0b154499794addbc2591a60652021-05-24T04:30:50ZengElsevierJournal of Materials Research and Technology2238-78542021-05-011217001714Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG)A.L. Teoh0M.A.A. Mohd Salleh1D.S.C. Halin2K.L. Foo3N.R. Abdul Razak4H. Yasuda5K. Nogita6Center of Excellence Geopolymer & Green Technology (CeGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, Jejawi, Arau, Perlis, 02600, MalaysiaCenter of Excellence Geopolymer & Green Technology (CeGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, Jejawi, Arau, Perlis, 02600, Malaysia; Corresponding author.Center of Excellence Geopolymer & Green Technology (CeGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, Jejawi, Arau, Perlis, 02600, MalaysiaInstitute of NanoElectronic Engineering (INEE), Universiti Malaysia Perlis, Kangar, Perlis, 01000, MalaysiaCenter of Excellence Geopolymer & Green Technology (CeGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, Jejawi, Arau, Perlis, 02600, Malaysia; Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland (UQ), Brisbane, QLD, 4072, AustraliaDepartment of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto, 606-8501, JapanNihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland (UQ), Brisbane, QLD, 4072, AustraliaThis paper details an investigation into the microstructure, thermal behaviors and joint strength of Sn-0.7Cu-1.5Bi solder alloy on electroless nickel immersion gold (ENIG) surface finish. Besides conventional techniques, the real-time synchrotron imaging was used to analyze the microstructure evolution in Sn-0.7Cu-1.5Bi/ENIG. This research investigated the growth behavior of the primary (Cu,Ni)6Sn5 intermetallic compounds (IMCs) in the solder joint with the Bi alloying. The elemental distribution analysis showed the Ni diffused from the ENIG surface finish and dissolved into the bulk solder during solidification and that the size of the primary (Cu,Ni)6Sn5 IMCs decreased due to the addition of 1.5 wt% Bi. The average kinetic growth rate of the primary (Cu,Ni)6Sn5 IMCs in Sn-0.7Cu-1.5Bi/ENIG was lower than that of the Sn-0.7Cu/ENIG. The thermal analysis revealed that the pasty range slightly increased and the undercooling degree decreased due to the addition of 1.5 wt% Bi for free-standing solder and soldering on ENIG surface finish. The shear strength of the Sn-0.7Cu-1.5Bi/ENIG was determined using a high-speed bond tester, and it increased by ~12% at bulk solder fracture of ~15% within the solder joint interfacial fracture due to the addition of 1.5 wt% Bi into the Sn-0.7Cu. These occurrences can be attributed to the solid solution strengthening effect at the bulk solder and the formation of finer interfacial (Cu,Ni)6Sn5 IMCs within the solder joints. The results indicated that the microstructural changes, especially the size reduction of IMCs, in Sn-0.7Cu-1.5Bi/ENIG impacted the joint strength.http://www.sciencedirect.com/science/article/pii/S2238785421002957Lead-free solderIntermetallic compoundSolid solution strengthening |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
A.L. Teoh M.A.A. Mohd Salleh D.S.C. Halin K.L. Foo N.R. Abdul Razak H. Yasuda K. Nogita |
spellingShingle |
A.L. Teoh M.A.A. Mohd Salleh D.S.C. Halin K.L. Foo N.R. Abdul Razak H. Yasuda K. Nogita Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG) Journal of Materials Research and Technology Lead-free solder Intermetallic compound Solid solution strengthening |
author_facet |
A.L. Teoh M.A.A. Mohd Salleh D.S.C. Halin K.L. Foo N.R. Abdul Razak H. Yasuda K. Nogita |
author_sort |
A.L. Teoh |
title |
Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG) |
title_short |
Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG) |
title_full |
Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG) |
title_fullStr |
Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG) |
title_full_unstemmed |
Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG) |
title_sort |
microstructure, thermal behavior and joint strength of sn-0.7cu-1.5bi/electroless nickel immersion gold (enig) |
publisher |
Elsevier |
series |
Journal of Materials Research and Technology |
issn |
2238-7854 |
publishDate |
2021-05-01 |
description |
This paper details an investigation into the microstructure, thermal behaviors and joint strength of Sn-0.7Cu-1.5Bi solder alloy on electroless nickel immersion gold (ENIG) surface finish. Besides conventional techniques, the real-time synchrotron imaging was used to analyze the microstructure evolution in Sn-0.7Cu-1.5Bi/ENIG. This research investigated the growth behavior of the primary (Cu,Ni)6Sn5 intermetallic compounds (IMCs) in the solder joint with the Bi alloying. The elemental distribution analysis showed the Ni diffused from the ENIG surface finish and dissolved into the bulk solder during solidification and that the size of the primary (Cu,Ni)6Sn5 IMCs decreased due to the addition of 1.5 wt% Bi. The average kinetic growth rate of the primary (Cu,Ni)6Sn5 IMCs in Sn-0.7Cu-1.5Bi/ENIG was lower than that of the Sn-0.7Cu/ENIG. The thermal analysis revealed that the pasty range slightly increased and the undercooling degree decreased due to the addition of 1.5 wt% Bi for free-standing solder and soldering on ENIG surface finish. The shear strength of the Sn-0.7Cu-1.5Bi/ENIG was determined using a high-speed bond tester, and it increased by ~12% at bulk solder fracture of ~15% within the solder joint interfacial fracture due to the addition of 1.5 wt% Bi into the Sn-0.7Cu. These occurrences can be attributed to the solid solution strengthening effect at the bulk solder and the formation of finer interfacial (Cu,Ni)6Sn5 IMCs within the solder joints. The results indicated that the microstructural changes, especially the size reduction of IMCs, in Sn-0.7Cu-1.5Bi/ENIG impacted the joint strength. |
topic |
Lead-free solder Intermetallic compound Solid solution strengthening |
url |
http://www.sciencedirect.com/science/article/pii/S2238785421002957 |
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