Interactions of Cu-substrates with titanium-alloyed Sn-Zn solders
The interactions of copper substrate with titanium-alloyed Sn-Zn eutectic solders have been studied. Two series of experiments have been performed. The first one consisted in differential thermal analyses of Sn-Zn nearly eutectic alloys containing from 1.3 to 2.2 wt. % Ti. Diffusion couples consiste...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Technical Faculty, Bor
2006-01-01
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| Series: | Journal of Mining and Metallurgy. Section B: Metallurgy |
| Subjects: | |
| Online Access: | http://www.doiserbia.nb.rs/img/doi/1450-5339/2006/1450-53390601045S.pdf |