Simulation analysis of heat transfer performance of heat sink with reduced material design
The field of electronic device applications is becoming more and more extensive. With the development of science and technology and the improvement of the integration of electronic components, local heating is becoming more and more serious. If heat cannot be discharged immediately, it will cause he...
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| Format: | Article |
| Language: | English |
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SAGE Publishing
2020-05-01
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| Series: | Advances in Mechanical Engineering |
| Online Access: | https://doi.org/10.1177/1687814020921300 |