Comparison of Tensile and Fatigue Properties of Copper Thin Film Depending on Process Method
In this study, tensile and fatigue tests were performed and analyzed to evaluate an influence of fabrication method on mechanical characteristics of copper thin film which widely used in flexible printed circuit board (FPCB). In general, manufacturing methods are known to affect the mechanical prope...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-01-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/10/1/388 |