Comparison of Tensile and Fatigue Properties of Copper Thin Film Depending on Process Method

• Main Authors: Hyeon-Gyu Min, Dong-Joong Kang, Jun-Hyub Park
• Format: Article
• Language: English
• Published: MDPI AG 2020-01-01
• Series: Applied Sciences
• Subjects: thin film; tensile test; fatigue test; mechanical properties; fatigue properties
• Online Access: https://www.mdpi.com/2076-3417/10/1/388

In this study, tensile and fatigue tests were performed and analyzed to evaluate an influence of fabrication method on mechanical characteristics of copper thin film which widely used in flexible printed circuit board (FPCB). In general, manufacturing methods are known to affect the mechanical properties of materials, especially for thin films. The copper thin film is manufactured by a rolling process or an electrodeposition process. Therefore, specimen for tensile and fatigue tests were fabricated using by etching process with the rolled and electrodeposited thin films. First, the tensile tests were performed to obtain the elastic modulus, 0.2% offset yield stress, and tensile strength of the rolled copper and the electrodeposited copper thin film. Second, the copper thin films in FPCB is most often subjected to mechanical or/and thermal cyclic loading. The fatigue tests were performed to compare the fatigue characteristics and to evaluate an influence of fabrication method. Tensile test results showed that the elastic modulus was similar for each process, but the 0.2% yield strength and ultimate tensile strength were greater in the rolling process. In addition, the fatigue test results show that the copper thin films by the rolling process are better than by the electrodeposition process in fatigue life in all region.