Robust Ag-Cu Sintering Bonding at 160 °C via Combining Ag<sub>2</sub>O Microparticle Paste and Pt-Catalyzed Formic Acid Vapor

Robust Ag-Cu Sintering Bonding at 160 °C via Combining Ag<sub>2</sub>O Microparticle Paste and Pt-Catalyzed Formic Acid Vapor

With the assistance of Pt-catalyzed formic acid vapor, robust Ag-Cu bonding was realized at an ultra-low temperature of 160 &#176;C under 3 MPa for 30 min via the sintering of Ag nanoparticles in situ generated from Ag<sub>2</sub>O microparticles. The Cu oxide layer at the interface...

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Bibliographic Details
Main Authors: Liangliang He, Junlong Li, Xin Wu, Fengwen Mu, Yinghui Wang, Yangting Lu, Tadatomo Suga
Format: Article
Language:English
Published: MDPI AG 2020-02-01
Series:Metals
Subjects:
sintering bonding
nanoparticles
ag<sub>2</sub>o microparticle
interface
die attach
Online Access:https://www.mdpi.com/2075-4701/10/3/315

Internet

https://www.mdpi.com/2075-4701/10/3/315

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