Analysis Of Factors Affecting Gravity-Induced Deflection For Large And Thin Wafers In Flatness Measurement Using Three-Point-Support Method
Accurate flatness measurement of silicon wafers is affected greatly by the gravity-induced deflection (GID) of the wafers, especially for large and thin wafers. The three-point-support method is a preferred method for the measurement, in which the GID uniquely determined by the positions of the supp...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Polish Academy of Sciences
2015-12-01
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| Series: | Metrology and Measurement Systems |
| Subjects: | |
| Online Access: | http://www.degruyter.com/view/j/mms.2015.22.issue-4/mms-2015-0052/mms-2015-0052.xml?format=INT |