Application of Hot-wire Method for Measuring Thermal Conductivity of Fine Ceramics
<p>Ceramic substrate is preferred in high density packaging due to its high electrical resistivity and moderate expansion coefficient. The thermal conductivity is a key parameter for packaging substrates. There are two common methods to measure the thermal conductivity, which are the hot-wire...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Kaunas University of Technology
2016-11-01
|
| Series: | Medžiagotyra |
| Subjects: | |
| Online Access: | http://matsc.ktu.lt/index.php/MatSc/article/view/12543 |