Comparative analysis of methods for the microcircuit assembly on flexible polyimide carriers
The article presents a classification of methods for the microcircuit assembly with the use of flexible polyimide carriers of different types, and their comparative analysis. The most appropriate method for the manufacturing of flexible dual-layer carriers is singled out.
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Politehperiodika
2013-10-01
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| Series: | Tekhnologiya i Konstruirovanie v Elektronnoi Apparature |
| Subjects: | |
| Online Access: | http://www.tkea.com.ua/tkea/2013/5_2013/pdf/08.zip |