Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment

Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment

In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter...

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Bibliographic Details
Main Authors: Lu Liu, Songbai Xue, Ruiyang Ni, Peng Zhang, Jie Wu
Format: Article
Language:English
Published: MDPI AG 2021-06-01
Series:Crystals
Subjects:
TSEP Sn–Bi
thermal cycling
temperature and humidity
shear force
microstructure
fracture morphology
Online Access:https://www.mdpi.com/2073-4352/11/7/733

Internet

https://www.mdpi.com/2073-4352/11/7/733

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