Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter...
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doaj-174fd57187a74da59bb3c7b15cde21da2021-07-23T13:36:27ZengMDPI AGCrystals2073-43522021-06-011173373310.3390/cryst11070733Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity TreatmentLu Liu0Songbai Xue1Ruiyang Ni2Peng Zhang3Jie Wu4College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, ChinaCollege of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, ChinaCollege of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, ChinaCollege of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, ChinaCollege of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, ChinaIn this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 °C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from −40 °C to 125 °C for 1000 cycles were investigated. Compared to the Sn–Bi solder joint, the TSEP Sn–Bi solder joints had increased reliability. The microstructure observation shows that the epoxy resin curing process did not affect the transformation of the microstructure. The shear force of the TSEP Sn–Bi solder joints after 1000 cycles of thermal cycling test was 1.23–1.35 times higher than the Sn–Bi solder joint and after 1000 h of temperature and humidity tests was 1.14–1.27 times higher than the Sn–Bi solder joint. The fracture analysis indicated that the cured cover layer could still have a mechanical reinforcement to the TSEP Sn–Bi solder joints after these reliability tests.https://www.mdpi.com/2073-4352/11/7/733TSEP Sn–Bithermal cyclingtemperature and humidityshear forcemicrostructurefracture morphology |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Lu Liu Songbai Xue Ruiyang Ni Peng Zhang Jie Wu |
spellingShingle |
Lu Liu Songbai Xue Ruiyang Ni Peng Zhang Jie Wu Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment Crystals TSEP Sn–Bi thermal cycling temperature and humidity shear force microstructure fracture morphology |
author_facet |
Lu Liu Songbai Xue Ruiyang Ni Peng Zhang Jie Wu |
author_sort |
Lu Liu |
title |
Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment |
title_short |
Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment |
title_full |
Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment |
title_fullStr |
Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment |
title_full_unstemmed |
Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment |
title_sort |
study on the reliability of sn–bi composite solder pastes with thermosetting epoxy under thermal cycling and humidity treatment |
publisher |
MDPI AG |
series |
Crystals |
issn |
2073-4352 |
publishDate |
2021-06-01 |
description |
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 °C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from −40 °C to 125 °C for 1000 cycles were investigated. Compared to the Sn–Bi solder joint, the TSEP Sn–Bi solder joints had increased reliability. The microstructure observation shows that the epoxy resin curing process did not affect the transformation of the microstructure. The shear force of the TSEP Sn–Bi solder joints after 1000 cycles of thermal cycling test was 1.23–1.35 times higher than the Sn–Bi solder joint and after 1000 h of temperature and humidity tests was 1.14–1.27 times higher than the Sn–Bi solder joint. The fracture analysis indicated that the cured cover layer could still have a mechanical reinforcement to the TSEP Sn–Bi solder joints after these reliability tests. |
topic |
TSEP Sn–Bi thermal cycling temperature and humidity shear force microstructure fracture morphology |
url |
https://www.mdpi.com/2073-4352/11/7/733 |
work_keys_str_mv |
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