Effects on the microstructure and mechanical properties of Sn-0.7Cu lead-free solder with the addition of a small amount of magnesium

The influence of a small amount of magnesium (only 0.01 wt.%) added to the Sn-0.7Cu solder alloy during the aging process of microstructural evolution is studied along with the mechanical properties of the alloy. The experimental results indicate that the addition of magnesium decreases the tensile...

Full description

Bibliographic Details
Main Authors:	Huang Her-Yueh, Yang Chung-Wei, Peng Yu-Chang
Format:	Article
Language:	English
Published:	De Gruyter 2016-11-01
Series:	Science and Engineering of Composite Materials
Subjects:	aging contact angle microstructure solder tensile strength
Online Access:	https://doi.org/10.1515/secm-2014-0130

id	doaj-18482df59b664061b171789a0524ea7e
record_format	Article
spelling	doaj-18482df59b664061b171789a0524ea7e2021-09-05T14:00:30ZengDe GruyterScience and Engineering of Composite Materials0792-12332191-03592016-11-0123664164710.1515/secm-2014-0130Effects on the microstructure and mechanical properties of Sn-0.7Cu lead-free solder with the addition of a small amount of magnesiumHuang Her-Yueh0Yang Chung-Wei1Peng Yu-Chang2Department of Materials Science and Engineering, National Formosa University, Yunlin 632, Taiwan, R.O.C.Department of Materials Science and Engineering, National Formosa University, Yunlin 632, Taiwan, R.O.C.Graduate Institute of Materials Science and Green Energy Engineering, National Formosa University, Yunlin 632, Taiwan, R.O.C.The influence of a small amount of magnesium (only 0.01 wt.%) added to the Sn-0.7Cu solder alloy during the aging process of microstructural evolution is studied along with the mechanical properties of the alloy. The experimental results indicate that the addition of magnesium decreases the tensile strength of the solders but improves their elongation. The solidification structure of eutectic Sn-0.7Cu consists of β-Sn, and the eutectic structure, which has extremely fine intermetallic nodules, Cu6Sn5, is located in the interdendritic region. When the magnesium is added to the Sn-0.7Cu alloy, the Sn dendrites become slightly coarser; in comparison, the melting point of the Sn-0.7Cu-0.01Mg alloy decreased by 2°C for the differential scanning calorimetry results of bulk alloy samples. Sn-0.7Cu-0.01Mg exhibits the lowest contact angles and the widest spreading areas. After aging, the Sn-0.7Cu and Sn-0.7Cu-0.01Mg solders show significant changes in strength, mainly because of the obvious increase in the thickness of the Cu6Sn5 intermetallic layer.https://doi.org/10.1515/secm-2014-0130agingcontact anglemicrostructuresoldertensile strength
collection	DOAJ
language	English
format	Article
sources	DOAJ
author	Huang Her-Yueh Yang Chung-Wei Peng Yu-Chang
spellingShingle	Huang Her-Yueh Yang Chung-Wei Peng Yu-Chang Effects on the microstructure and mechanical properties of Sn-0.7Cu lead-free solder with the addition of a small amount of magnesium Science and Engineering of Composite Materials aging contact angle microstructure solder tensile strength
author_facet	Huang Her-Yueh Yang Chung-Wei Peng Yu-Chang
author_sort	Huang Her-Yueh
title	Effects on the microstructure and mechanical properties of Sn-0.7Cu lead-free solder with the addition of a small amount of magnesium
title_short	Effects on the microstructure and mechanical properties of Sn-0.7Cu lead-free solder with the addition of a small amount of magnesium
title_full	Effects on the microstructure and mechanical properties of Sn-0.7Cu lead-free solder with the addition of a small amount of magnesium
title_fullStr	Effects on the microstructure and mechanical properties of Sn-0.7Cu lead-free solder with the addition of a small amount of magnesium
title_full_unstemmed	Effects on the microstructure and mechanical properties of Sn-0.7Cu lead-free solder with the addition of a small amount of magnesium
title_sort	effects on the microstructure and mechanical properties of sn-0.7cu lead-free solder with the addition of a small amount of magnesium
publisher	De Gruyter
series	Science and Engineering of Composite Materials
issn	0792-1233 2191-0359
publishDate	2016-11-01
description	The influence of a small amount of magnesium (only 0.01 wt.%) added to the Sn-0.7Cu solder alloy during the aging process of microstructural evolution is studied along with the mechanical properties of the alloy. The experimental results indicate that the addition of magnesium decreases the tensile strength of the solders but improves their elongation. The solidification structure of eutectic Sn-0.7Cu consists of β-Sn, and the eutectic structure, which has extremely fine intermetallic nodules, Cu6Sn5, is located in the interdendritic region. When the magnesium is added to the Sn-0.7Cu alloy, the Sn dendrites become slightly coarser; in comparison, the melting point of the Sn-0.7Cu-0.01Mg alloy decreased by 2°C for the differential scanning calorimetry results of bulk alloy samples. Sn-0.7Cu-0.01Mg exhibits the lowest contact angles and the widest spreading areas. After aging, the Sn-0.7Cu and Sn-0.7Cu-0.01Mg solders show significant changes in strength, mainly because of the obvious increase in the thickness of the Cu6Sn5 intermetallic layer.
topic	aging contact angle microstructure solder tensile strength
url	https://doi.org/10.1515/secm-2014-0130
work_keys_str_mv	AT huangheryueh effectsonthemicrostructureandmechanicalpropertiesofsn07culeadfreesolderwiththeadditionofasmallamountofmagnesium AT yangchungwei effectsonthemicrostructureandmechanicalpropertiesofsn07culeadfreesolderwiththeadditionofasmallamountofmagnesium AT pengyuchang effectsonthemicrostructureandmechanicalpropertiesofsn07culeadfreesolderwiththeadditionofasmallamountofmagnesium
_version_	1717811822032060416

Effects on the microstructure and mechanical properties of Sn-0.7Cu lead-free solder with the addition of a small amount of magnesium

Similar Items