Effect of Flux onto Intermetallic Compound Formation and Growth

In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn-3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C...

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Bibliographic Details
Main Authors: Idris Siti Rabiatull Aisha, Farihan Noor, Kahar Hardinnawirda
Format: Article
Language:English
Published: EDP Sciences 2016-01-01
Series:MATEC Web of Conferences
Online Access:http://dx.doi.org/10.1051/matecconf/20167400034