Effect of Flux onto Intermetallic Compound Formation and Growth
In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn-3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2016-01-01
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| Series: | MATEC Web of Conferences |
| Online Access: | http://dx.doi.org/10.1051/matecconf/20167400034 |