Machine Learning-Based Wheel Monitoring for Sapphire Wafers
The thinning of sapphire wafers is a key process that affects the quality of optoelectronic devices. In the grinding process for sapphire, a hard and brittle material, the grade and surface conditions (wearing and chip loading) of the grinding wheel are the key to continuous processing and reduction...
Main Authors: | , |
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Format: | Article |
Language: | English |
Published: |
IEEE
2021-01-01
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Series: | IEEE Access |
Subjects: | |
Online Access: | https://ieeexplore.ieee.org/document/9381866/ |