Nanofabrication for all-soft and high-density electronic devices based on liquid metal
Though all-soft electronic devices with liquid metals are attractive due to the material’s compatibility with patterning methods, obtaining sub-micron patterns remains a challenge. Here, the authors report a hybrid lithography process to realize all-soft submicron-scale devices based on EGaIn.
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Publishing Group
2020-02-01
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| Series: | Nature Communications |
| Online Access: | https://doi.org/10.1038/s41467-020-14814-y |