Microstructural evolution during high-temperature tensile creep at 1,500°C of a MoSiBTiC alloy
Microstructural evolution in the TiC-reinforced Mo–Si–B-based alloy during tensile creep deformation at 1,500°C and 137 MPa was investigated via scanning electron microscope-backscattered electron diffraction (SEM-EBSD) observations. The creep curve of th...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
De Gruyter
2020-04-01
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| Series: | High Temperature Materials and Processes |
| Subjects: | |
| Online Access: | https://doi.org/10.1515/htmp-2020-0039 |