Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys
During soldering process intermetallic compounds as a reaction between solder and substrate are created. Physical properties of those compounds are different to properties of solder and substrate. The influence of intermetallic compounds (IMC) on radio frequency resistance of soldered joint has been...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Spolecnost pro radioelektronicke inzenyrstvi
2012-06-01
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| Series: | Radioengineering |
| Subjects: | |
| Online Access: | http://www.radioeng.cz/fulltexts/2012/12_02_0573_0579.pdf |