Study on the Thermal Resistance of Multi-chip Module High Power LED Packaging Heat Dissipation System

Study on the Thermal Resistance of Multi-chip Module High Power LED Packaging Heat Dissipation System

Thermal resistance is a key technical index which indicates the thermal management of multi-chip module high power LED (MCM-LED) packaging heat dissipation system. In this paper, the prototype structure of MCM-LED packaging heat dissipation system is proposed to study the reliable thermal resistance...

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Bibliographic Details
Main Authors: Kailin Pan, Hua Lin, Yu Guo, Na Wei, Tao Lu, Bin Zhou
Format: Article
Language:English
Published: IFSA Publishing, S.L. 2014-10-01
Series:Sensors & Transducers
Subjects:
High power LED
Thermal resistance
Heat dissipation system
T3Ster
Finite element simulation.
Online Access:http://www.sensorsportal.com/HTML/DIGEST/october_2014/Vol_180/P_2441.pdf

Internet

http://www.sensorsportal.com/HTML/DIGEST/october_2014/Vol_180/P_2441.pdf

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