Power Semiconductor Devices and Packages: Solder Mechanical Characterization and Lifetime Prediction

Power Semiconductor Devices and Packages: Solder Mechanical Characterization and Lifetime Prediction

Solder reliability is a key aspect for the packaging of low voltage power semiconductor device. The interconnections among package components, e.g. the silicon chip and copper leadframe, and between package itself and the external printed control board (PCB) should be properly designed to ensure the...

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Bibliographic Details
Main Authors: Michele Calabretta, Alessandro Sitta, Salvatore Massimo Oliveri, Gaetano Sequenzia
Format: Article
Language:English
Published: IEEE 2021-01-01
Series:IEEE Access
Subjects:
Reliability
material characterization
finite element model
power semiconductor package
Online Access:https://ieeexplore.ieee.org/document/9344601/

Internet

https://ieeexplore.ieee.org/document/9344601/

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