Power Semiconductor Devices and Packages: Solder Mechanical Characterization and Lifetime Prediction
Solder reliability is a key aspect for the packaging of low voltage power semiconductor device. The interconnections among package components, e.g. the silicon chip and copper leadframe, and between package itself and the external printed control board (PCB) should be properly designed to ensure the...
Main Authors: | , , , |
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Format: | Article |
Language: | English |
Published: |
IEEE
2021-01-01
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Series: | IEEE Access |
Subjects: | |
Online Access: | https://ieeexplore.ieee.org/document/9344601/ |