Thermal Aspects Related to Power Assemblies
In many cases when a power assembly based on power semiconductors is used, catastrophic failure is the result of steep temperature gradient in the localized temperature distribution. Hence, an optimal heatsink design for certain industrial applications has become a real necessity. In this paper, the...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Stefan cel Mare University of Suceava
2010-02-01
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| Series: | Advances in Electrical and Computer Engineering |
| Subjects: | |
| Online Access: | http://dx.doi.org/10.4316/AECE.2010.01004 |