Study on the Interfacial Residual Stress of Flip-Chip Joints Based on Anisotropic Conductive Adhesive
Interfacial residual stress resulting from coefficient of thermal expansion mismatch between different layers of the flip-chip joint is induced during the bonding process. The flip-chip joints suffer residual stresses that may cause cracking or delamination, which is one of the major reliability iss...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2019-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/8917614/ |