SMT Assembly Inspection Using Dual-Stream Convolutional Networks and Two Solder Regions
The automated optical inspection of a surface mount technology line inspects a printed circuit board for quality assurance, and subsequently classifies the chip assembly defects. However, it is difficult to improve the accuracy of previous defect classification methods using full chip component imag...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2020-07-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/10/13/4598 |