Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process

Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process

This paper presents a process for the fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using glass reflow and anodic bonding techniques. Silicon through-wafer interconnects have been investigated by the glass reflow process. Then, the patterned silicon-glass...

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Bibliographic Details
Main Authors: Nguyen Van Toan, Shim Hahng, Yunheub Song, Takahito Ono
Format: Article
Language:English
Published: MDPI AG 2016-04-01
Series:Micromachines
Subjects:
capacitive micromachined ultrasonic transducer
glass reflow process
anodic bonding
medical imaging
non-destructive measurement
chemical sensing
Online Access:http://www.mdpi.com/2072-666X/7/5/76

Internet

http://www.mdpi.com/2072-666X/7/5/76

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