Molecular dynamics investigation of the slip flow liquid–solid interfacial thermal conductance
With the integrated high-power device packaging structure rapidly developing, the embedded heat dissipation architectures are challenged by the local micro-/nanoscale massive heat flux. The slip flow molecular dynamics models were established to explore the liquid–solid interfacial thermal conductan...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2021-05-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/5.0050291 |